Intel has begun installing production equipment at Fab 62 on its Ocotillo campus in Arizona, moving the project past the building construction stage. The company expects the facility to become operational before the end of 2028. Intel has not said when high-volume production will start or which process nodes the fab will run.
Fab 62 will be the sixth high-volume semiconductor manufacturing fab at the Ocotillo site, which has served as one of Intel's primary production locations for decades. Intel has not disclosed the fab's planned wafer processing capacity or the capital expenditures needed to complete it. The equipment installation nonetheless shows the project is advancing beyond the shell of the building.
Intel has not officially assigned its Intel 14A node to Fab 62, though the facility has been discussed as a possible site for it. When Intel announced Fab 52 and Fab 62 in Arizona, it said both would make its most advanced process technologies, including Intel 20A and 18A. Intel later designated Fab 52 for Intel 18A manufacturing, while Fab 62 remains unassigned. Under the process roadmap Intel disclosed earlier this year, Fab 62 would be capable of producing chips on the 18A, 18A-P and 14A nodes.
Intel was the first chipmaker to install a commercial High-NA EUV scanner, at its D1X fab near Hillsboro, Oregon, and later used the tool in high-volume manufacturing for Panther Lake and other chips. The Gordon Moore Park at Ronler Acres in Oregon is where Intel develops its most advanced logic process technologies and starts volume production of its latest processors. It appears, though Intel has not explicitly confirmed it, that the High-NA EUV scanners currently produce the same circuits as Low-NA EUV machines, so the next-generation tools do not necessarily offer significant advantages over existing lithography scanners.
In Ohio, construction workers recently installed the first major structural truss at the first fab of Intel's Ohio One complex in New Albany. Intel did not provide an updated construction schedule for Ohio One, say when the first fab will begin operations, identify the process technology it will use or estimate its manufacturing capacity.
Intel continues to invest in advanced packaging, with Oregon as its main R&D center for advanced logic and 3D interconnect technologies and Arizona hosting advanced packaging R&D, assembly and testing. Its New Mexico site produces complex multi-chiplet processors using advanced packaging methods, from EMIB through EMIB-T and Foveros. Intel also recently broke ground on a photomask manufacturing facility in Santa Clara, California.
Intel said its U.S. operations involve more than 4,500 suppliers across 49 states, with annual domestic expenditures exceeding $29 billion. The company stressed that domestic semiconductor leadership requires research, process development, advanced packaging and a comprehensive supply chain, not only wafer fabrication capacity.
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